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Title: Microelectromechanical RF switch
US. Patent: 6,639,494 (Oct 28, 2003)
Assignee: Northrop Grumman Corporation
Abstract: A MEMS switch with a bridge having three symmetric arms each having one end connected to a support arrangement and another end integral with a common central bridge portion. First and second conductors are deposited on a substrate, with the first conductor having an end with an open area which encompasses a pull down electrode which is also on the substrate, and of a height less than that of the conductor. A control voltage applied to the pull down electrode causes downward movement of the bridge, to
present a relatively low impedance, thereby allowing a signal to propagate between the first and second conductors, without the bridge touching the pull down electrode. Each of the arms is slotted to reduce curl-induced stiffness.  專利全文說明書
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Title: MEMS RF switch with low actuation voltage
US. Patent: 6,639,488 (Oct 28, 2003)
Assignee: IBM Corporation
Abstract: Disclosed is a capacitive electrostatic MEMS RF switch comprised of a lower electrode that acts as both a transmission line and as an actuation electrode. Also, there is an array of one or more fixed beams above the lower electrode that is connected to ground. The lower electrode transmits the RF signal when the top beam or beams are up and when the upper beams are actuated and bent down, the transmission line is shunted to ground ending the RF transmission. A high dielectric constant material is used in the capacitive portion of the switch to achieve a high capacitance per unit area thus reducing the required chip area and enhancing the insertion loss characteristics in the non-actuated state. A gap between beam and lower electrode of less than 1 .mu.m is incorporated in order to minimize the electrostatic potential (pull-in voltage) required to actuate the switch. 專利全文說明書
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Title: MEMS-based thin-film fuel cells
US. Patent: 6,638,654 (Oct 28, 2003)
Assignee: The Regents of the University of California
Abstract: A micro-electro-mechanical systems (MEMS) based thin-film fuel cells for electrical power applications. The MEMS-based fuel cell may be of a solid oxide type (SOFC), a solid polymer type (SPFC), or a proton exchange membrane type (PEMFC), and each fuel cell basically consists of an anode and a cathode separated by an electrolyte layer. Additionally catalyst layers can also separate the electrodes (cathode and anode) from the electrolyte. Gas manifolds are utilized to transport the fuel and oxidant to each
cell and provide a path for exhaust gases. The electrical current generated from each cell is drawn away with an interconnect and support structure integrated with the gas manifold. The fuel cells utilize integrated resistive heaters for efficient heating of the materials. By combining MEMS technology with thin-film deposition technology, thin-film fuel cells having microflow channels and full-integrated circuitry can be produced that will lower the operating temperature an will yield an order of magnitude greater power density than the currently known fuel cells. 專利全文說明書
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Title: High Q-large tuning range micro-electro mechanical system (MEMS) varactor for broadband applications
US. Patent: 6,635,919 (Oct 21, 2003)
Assignee: Texas Instruments Incorporated
Abstract: A Micro Electro-Mechanical System (MEMS) varactor having a bottom electrode formed over a substrate and a dielectric material disposed over the bottom electrode. A pull-down electrode is formed over spacer and the dielectric material. The MEMS varactor is adapted to operate in a stiction mode, with at least a portion of pull-down electrode in contact with dielectric material. The MEMS varactor has a high Q, large tuning range, and high sensitivity. 專利全文說明書
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Title: MEMS micro-relay with coupled electrostatic and electromagnetic actuation
US. Patent: 6,635,837 (Oct 21, 2003)
Assignee: ADC Telecommunications, Inc.
Abstract: A microelectromechanical relay and a method of fabricating the same that combines electrostatic actuation with electromagnetic actuation. The relay has very low contact resistance when the relay is in its ON state and enhanced contact-to-contact isolation when the relay is in its OFF state. The relay includes a substrate having a trench formed therein, a first pair of contacts located in the trench and an actuator for controllably establishing electrical contact between the first pair of contacts. The actuator includes
spaced apart supports on the substrate and a movable beam extending between the supports. A contact cross bar is located on the movable beam facing the first pair of contacts. A first electrode is located on the movable beam and a second electrode is located on the substrate. Electromagnetic force is used to deflect the movable beam towards the substrate and then electrostatic force is used to bring the contact cross bar in physical contact with the first pair of contacts. 專利全文說明書
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Title: Wafer-level MEMS packaging
US. Patent: 6,635,509 (Oct 21, 2003)
Assignee: Dalsa Semiconductor Inc.
Abstract: A competitive, simple, single-substrate wafer-level packaging technique capable of creating a vacuum-sealed protective cavity around moving or other particular components of a MEMS is described. The technique uses common semiconductor materials, processing steps and equipment to provide a stable vacuum environment of, for example less than 1 Pa, in a sealed cavity. The environment protects components of the MEMS against micro-contamination from particles and slurry of a waver dicing process and against fluctuations of atmospheric condition to ensure long term reliability. 專利全文說明書
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Title: Electronically latching micro-magnetic switches and method of operating same
US. Patent: 6,633,212 (Oct 14, 2003)
Assignee: Arizona State University
Abstract: A switch with an open state and a closed state suitably includes a cantilever having first and second state corresponding to the open and closed states of the switch, respectively. The switch may also include a magnet configured to provide an electromagnetic field that maintains said cantilever in one of the first and second states. Various embodiments may also include an electrode or electrical conductor configured to provide an electric potential or electromagnetic pulse, as appropriate, to switch the cantilever between the first and second states. Various embodiments may be formulated with micromachining technologies, and may be formed on a substrate. 專利全文說明書
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Title: Integrated microfluidic and electronic components
US. Patent: 6,632,400 (Oct 14, 2003)
Assignee: Agilent Technologies, Inc.
Abstract: A microfluidic component having a microfluidic channel is bonded to an electronics component having a circuit for processing signals related to the microfluidic component. In an embodiment, the electronics component is a prefabricated integrated circuit chip that includes signal processing and/or process control functionality. The bonding of the microfluidic component to the electronics component provides a modular architecture in which different combinations of microfluidic components and electronics components can be used to create customized processing and analysis tools. 專利全文說明書
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Title: Powered orthodontic bracket
US. Patent: 6,632,088 (Oct 14, 2003)
Assignee: OrthoArm, Inc.
Abstract: An orthodontic bracket assembly comprising an orthodontic bracket and a powered actuator mounted to the bracket. The actuator can be used to provide relative movement between a tooth (or set of teeth) and another object, such as an archwire or another tooth (or set of teeth). Preferably, the actuator is a micro electromechanical system (MEMS) having a size that will not significantly interfere with the comfort of the patient.專利全文說明書
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Title: Center-mass-reduced microbridge structures for ultra-high frequency MEM resonator
US. Patent: 6,630,871 (Oct 7, 2003)
Assignee: Intel Corporation
Abstract: A micro-electromechanical (MEM) resonator is described that includes a substrate, a microbridge beam structure coupled to the substrate and at least one electrode disposed adjacent to the microbridge beam structure to induce vibration of the beam. The microbridge beam structure includes support sections and a beam formed between the support sections. The center region of the beam has a mass that is less than the mass of regions of the beam adjacent to the support sections. 專利全文說明書
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Title: In-situ testing of a MEMS accelerometer in a disc storage system
US. Patent: 6,629,448 (Oct 7, 2003)
Assignee: Seagate Technology LLC
Abstract: A disc storage system performing an in-situ test on a MEMS accelerometer, in a disc drive. The circuit includes a control circuit that establishes a desired self test condition conducive to the in-situ test during a self test interval. The circuit includes a stored reference representing at least one characteristic limit of an integrity output of the, MEMS accelerometer. The circuit includes a test circuit that receives the integrity output value and the stored reference during the in-situ test interval and that generates an in-situ test output representative of integrity of the MEMS accelerometer. Damaged or degraded MEMS accelerometers can be diagnosed in-situ. 專利全文說明書
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Title: MEMS heat pumps for integrated circuit heat dissipation
US. Patent: 6,629,425 (Oct 7, 2003)
Assignee: Micron Technology, Inc.
Abstract: A cooling mechanism within an integrated circuit includes an internal pump for circulating thermally conductive fluid within closed loop channels. The cooling channels are embedded within an integrated circuit die, such as in interlevel dielectric layers between metal levels. The channels are formed by engineering deposition of a layer to line trenches and form continuous voids along the trenches. Exemplary heat pumps comprise cavities, formed in communication with the channels, covered by piezoelectric
actuators. Preferably, the actuators are wired to act in sequence as a peristaltic pump, circulating the fluid within the channels. The channels are positioned to carry heat from active devices within the integrated circuit, and a heat sink carries heat from the die. 專利全文說明書 |
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